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DAC
2009
ACM
16 years 5 months ago
Spare-cell-aware multilevel analytical placement
Post-silicon validation has recently drawn designers' attention due to its increasing impacts on the VLSI design cycle and cost. One key feature of the post-silicon validatio...
Zhe-Wei Jiang, Meng-Kai Hsu, Yao-Wen Chang, Kai-Yu...
DAC
2009
ACM
16 years 5 months ago
O-Router:an optical routing framework for low power on-chip silicon nano-photonic integration
In this work, we present a new optical routing framework, O-Router for future low-power on-chip optical interconnect integration utilizing silicon compatible nano-photonic devices...
Duo Ding, Yilin Zhang, Haiyu Huang, Ray T. Chen, D...
152
Voted
DAC
2009
ACM
16 years 5 months ago
Designing heterogeneous ECU networks via compact architecture encoding and hybrid timing analysis
In this paper, a design method for automotive architectures is proposed. The two main technical contributions are (i) a novel hardware/software architecture encoding that unifies ...
Jürgen Teich, Martin Lukasiewycz, Michael Gla...
DAC
2007
ACM
16 years 5 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
109
Voted
DAC
2000
ACM
16 years 4 months ago
GTX: the MARCO GSRC technology extrapolation system
Technology extrapolation -- the calibration and prediction of achievable design in future technology generations ? drives the evolution of VLSI system architectures, design method...
Andrew E. Caldwell, Yu Cao, Andrew B. Kahng, Farin...