64 search results - page 6 / 13 » The Impact of Silicon Photonics |
84
Voted
HPCA
2000
IEEE
15 years 2 months ago
2000
IEEE
This paper explores area/parallelism tradeo s in the design of distributed shared-memory (DSM) multiprocessors built out of large single-chip computing nodes. In this context, are...
ICCAD
2008
IEEE
15 years 6 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
ITC
1996
IEEE
15 years 1 months ago
1996
IEEE
While technology is changing the face of the world, it itself is changing by leaps and bounds; there is a continuing trend to put more functionality on the same piece of silicon. ...
MSWIM
2006
ACM
15 years 3 months ago
2006
ACM
The simulation of wireless networks has been an important tool for researchers and the industry in the last years. Especially in the field of Mobile Ad Hoc Networking, most curre...
3DIC
2009
IEEE
15 years 4 months ago
2009
IEEE
—The physical performance of a 3-Dimensional Network-on-Chip (NoC) mesh architecture employing Through Silicon Vias (TSV) for vertical connectivity is investigated with a cycle-a...