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152
Voted
3DGIS
2006
Springer
16 years 3 days ago
2006
Springer
Abstract Three-dimensional (3D) building model is one of the most important components in a cyber city implementation and application. This study developed an effective and highly ...
147
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GLVLSI
2005
IEEE
15 years 11 months ago
2005
IEEE
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
166
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CASES
2010
ACM
15 years 3 months ago
2010
ACM
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
132
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IPSN
2010
Springer
16 years 18 days ago
2010
Springer
In this paper, we propose a Vehicular Surveillance and Sensing System (VS3 ), which targets at car security and tracking applications. VS3 can be triggered by events detected insi...
174
Voted
BMCBI
2007
15 years 6 months ago
2007
nd: A key abstraction in representing proteomics knowledge is the notion of unique identifiers for individual entities (e.g. proteins) and the massive graph of relationships among...