Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
As chip complexity grows, design productivity boost is expected from reuse of large parts and blocks of previous designs with the design effort largely invested into the new parts...
Similarity-based search over time-series databases has been a hot research topic for a long history, which is widely used in many applications, including multimedia retrieval, dat...
Qiuxia Chen, Lei Chen 0002, Xiang Lian, Yunhao Liu...