Due to shrinking technologies and increasing design sizes, it is becoming more difficult and expensive to distribute a global clock signal with low skew throughout a processor di...
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
—A 25MHz all-CMOS clock generator is demonstrated where measured performance makes it suitable for direct replacement of the reference crystal oscillator (XO) for serial wire int...
Michael S. McCorquodale, Scott M. Pernia, Sundus K...
In this work, we report on an unprecedented design where digital, analog, and MEMS technologies are combined to realize a generalpurpose single-chip CMOS microsystem. The converge...
Robert M. Senger, Eric D. Marsman, Michael S. McCo...
Motion Estimation (ME) is the most computationally intensive and the most power consuming part of video compression and video enhancement systems. In this paper, we propose a nove...
Caglar Kalaycioglu, Onur C. Ulusel, Ilker Hamzaogl...