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ASPDAC
2007
ACM
131views Hardware» more  ASPDAC 2007»
15 years 8 months ago
Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign
Deep submicron effects drive the complication in designing chips, as well as in package designs and communications between package and board. As a result, the iterative interface d...
Ren-Jie Lee, Ming-Fang Lai, Hung-Ming Chen
DAC
2010
ACM
15 years 8 months ago
Processor virtualization and split compilation for heterogeneous multicore embedded systems
Complex embedded systems have always been heterogeneous multicore systems. Because of the tight constraints on power, performance and cost, this situation is not likely to change a...
Albert Cohen, Erven Rohou
COOPIS
2004
IEEE
15 years 8 months ago
A Mobile Agent Infrastructure for QoS Negotiation of Adaptive Distributed Applications
Abstract. QoS-aware distributed applications such as certain Multimedia and Ubiquitous Computing applications can benefit greatly from the provision of QoS guarantees from the unde...
Roberto Speicys Cardoso, Fabio Kon
DATE
2004
IEEE
144views Hardware» more  DATE 2004»
15 years 8 months ago
A Framework for Battery-Aware Sensor Management
A distributed sensor network (DSN) designed to cover a given region R, is said to be alive if there is at least one subset of sensors that can collectively cover (sense) the regio...
Sridhar Dasika, Sarma B. K. Vrudhula, Kaviraj Chop...
DAWAK
2006
Springer
15 years 8 months ago
Extending Visual OLAP for Handling Irregular Dimensional Hierarchies
Comprehensive data analysis has become indispensable in a variety of environments. Standard OLAP (On-Line Analytical Processing) systems, designed for satisfying the reporting need...
Svetlana Mansmann, Marc H. Scholl