1023 search results - page 34 / 205 » The Simulation and Design of Integrated Inductors |
VLSID
2010
IEEE
14 years 8 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
DPHOTO
2009
14 years 7 months ago
2009
Under low illumination conditions, such as moonlight, there simply are not enough photons present to create a high quality color image with integration times that avoid camera-sha...
DATE
2008
IEEE
15 years 4 months ago
2008
IEEE
Simulation of transaction level models (TLMs) is an established embedded systems design technique. Its use cases include virtual prototyping for early software development, platfo...
AADEBUG
2005
Springer
15 years 3 months ago
2005
Springer
Reprogrammable hardware systems are traditionally very difficult to debug due to their high level of parallelism. In our solution to this problem, features are inserted into the u...
TCAD
2002
14 years 9 months ago
2002
With the advent of system-on-a-chip design, many application specific integrated circuits (ASICs) now require multiple design clocks that operate asynchronously to each other. This...