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TCAD
2008
114views more  TCAD 2008»
14 years 9 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
BMCBI
2005
93views more  BMCBI 2005»
14 years 9 months ago
Two-part permutation tests for DNA methylation and microarray data
Background: One important application of microarray experiments is to identify differentially expressed genes. Often, small and negative expression levels were clipped-off to be e...
Markus Neuhäuser, Tanja Boes, Karl-Heinz J&ou...
JSAC
2007
153views more  JSAC 2007»
14 years 9 months ago
Cooperative Relay Service in a Wireless LAN
As a family of wireless local area network (WLAN) protocols between physical layer and higher layer protocols, IEEE 802.11 has to accommodate the features and requirements of both...
Lei Guo, Xiaoning Ding, Haining Wang, Qun Li, Song...
JSAC
2007
132views more  JSAC 2007»
14 years 9 months ago
Lifetime maximization via cooperative nodes and relay deployment in wireless networks
— Extending lifetime of battery-operated devices is a key design issue that allows uninterrupted information exchange among distributed nodes in wireless networks. Cooperative co...
Thanongsak Himsoon, W. Pam Siriwongpairat, Zhu Han...
TVLSI
2008
105views more  TVLSI 2008»
14 years 9 months ago
Robust Concurrent Online Testing of Network-on-Chip-Based SoCs
Lifetime concerns for complex systems-on-a-chip (SoC) designs due to decreasing levels in reliability motivate the development of solutions to ensure reliable operation. A precurso...
Praveen Bhojwani, Rabi N. Mahapatra