104 search results - page 4 / 21 » Thermal Characterization and Thermal Management in Processor... |
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TCAD
2008
15 years 21 days ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
104
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ASPLOS
2006
ACM
15 years 6 months ago
2006
ACM
Power densities have been increasing rapidly at all levels of server systems. To counter the high temperatures resulting from these densities, systems researchers have recently st...
108
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RTAS
2009
IEEE
15 years 7 months ago
2009
IEEE
Thermal management becomes a prominent issue in system design for both server systems and embedded systems. A system could fail if the peak temperature exceeds its thermal constra...
84
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DAC
2009
ACM
16 years 1 months ago
2009
ACM
This paper suggests that the thermal state of a processor can be approximated using data flow analysis. The results of this analysis can be used to evaluate the efficacy of therma...
119
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ISCA
2006
IEEE
15 years 23 days ago
2006
IEEE
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...