528 search results - page 2 / 106 » Thermal Management in Embedded Systems Using MEMS |
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
—Dynamic Thermal Management techniques have been widely accepted as a thermal solution for their low cost and simplicity. The techniques have been used to manage the heat dissipa...
GLVLSI
2010
IEEE
15 years 2 months ago
2010
IEEE
Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. The goal of thermal mana...
ISQED
2007
IEEE
15 years 3 months ago
2007
IEEE
— In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power and energy optimization in embedded system design. As thermal issues become increasingl...
ECRTS
2007
IEEE
15 years 3 months ago
2007
IEEE
Today’s CPUs consume a significant amount of power and generate a high amount of heat, requiring an active cooling system to support reliable operations. In case of cooling sys...
CASES
2006
ACM
15 years 3 months ago
2006
ACM
Designers of SoCs with non-digital components, such as analog or MEMS devices, can currently use high-level system design languages, such as SystemC, to model only the digital par...