528 search results - page 3 / 106 » Thermal Management in Embedded Systems Using MEMS |
RTAS
2009
IEEE
15 years 4 months ago
2009
IEEE
Thermal management becomes a prominent issue in system design for both server systems and embedded systems. A system could fail if the peak temperature exceeds its thermal constra...
RTCSA
2009
IEEE
15 years 4 months ago
2009
IEEE
Distributed real-time embedded systems have stringent requirements for key performance properties, such as endto-end timeliness and reliability, in order to operate properly. In r...
ASPLOS
2006
ACM
15 years 3 months ago
2006
ACM
Power densities have been increasing rapidly at all levels of server systems. To counter the high temperatures resulting from these densities, systems researchers have recently st...
DAC
2006
ACM
15 years 10 months ago
2006
ACM
With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...
ISCAS
2006
IEEE
2006
IEEE
Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures
15 years 3 months ago
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...