528 search results - page 4 / 106 » Thermal Management in Embedded Systems Using MEMS |
100
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TCAD
2008
14 years 9 months ago
2008
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
100
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TCAD
2008
14 years 9 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
108
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DAC
2006
ACM
14 years 11 months ago
2006
ACM
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
125
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DAC
2009
ACM
15 years 10 months ago
2009
ACM
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
FPL
2006
Springer
15 years 1 months ago
2006
Springer
Given large circuit sizes, high clock frequencies, and possibly extreme operating environments, Field Programmable Gate Arrays (FPGAs) are capable of heating beyond their designed...