528 search results - page 8 / 106 » Thermal Management in Embedded Systems Using MEMS |
ICCD
2005
IEEE
15 years 6 months ago
2005
IEEE
FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatu...
ISPASS
2005
IEEE
15 years 3 months ago
2005
IEEE
We have previously presented Qsilver, a flexible simulation system for graphics architectures. In this paper we describe our extensions to this system, which we use— instrument...
DAC
2008
ACM
15 years 10 months ago
2008
ACM
Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new model of a thermally-managed system, where a stoch...
DATE
2010
IEEE
15 years 2 months ago
2010
IEEE
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
CODES
2007
IEEE
15 years 3 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...