528 search results - page 9 / 106 » Thermal Management in Embedded Systems Using MEMS |
CASES
2007
ACM
15 years 1 months ago
2007
ACM
We derive analytically, the performance optimal throttling curve for a processor under thermal constraints for a given task sequence. We found that keeping the chip temperature co...
ICCD
2007
IEEE
15 years 6 months ago
2007
IEEE
This paper proposes Dynamic Thermal Management (DTM) based on a dynamic voltage and frequency scaling (DVFS) technique for MPEG-4 decoding to guarantee thermal safety while mainta...
80
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DAC
2009
ACM
15 years 4 months ago
2009
ACM
With new technologies, temperature has become a major issue to be considered at system level design. Without taking temperature aspects into consideration, no approach to energy o...
ICCAD
2010
IEEE
14 years 7 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
131
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MJ
2011
14 years 4 months ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...