7 search results - page 2 / 2 » Thermal analysis of a 3D die-stacked high-performance microp... |
VLSID
2007
IEEE
14 years 6 months ago
2007
IEEE
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
ICCAD
2001
IEEE
14 years 3 months ago
2001
IEEE
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...