276 search results - page 10 / 56 » Thermal modeling and management of DRAM memory systems |
ASPDAC
2006
ACM
15 years 3 months ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
91
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ICAC
2006
IEEE
15 years 3 months ago
2006
IEEE
— Recent advances have demonstrated the potential benefits of coordinated management of thermal load in data centers, including reduced cooling costs and improved resistance to ...
130
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MJ
2011
14 years 4 months ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
CASES
2004
ACM
15 years 1 months ago
2004
ACM
The tremendous growth of system memories has increased the capacities and capabilities of memory-resident embedded databases, yet current embedded databases need to be tuned in or...
79
Voted
IPPS
2005
IEEE
15 years 3 months ago
2005
IEEE
As energy consumption in high-performance systems has increased, thermal management has become a big challenge. Providing a cost-effective and detailed temperature sensing mechani...