1635 search results - page 10 / 327 » Thermally Aware Design |
ICCAD
2006
IEEE
15 years 6 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
—Localized heating-up creates thermal hotspots across the chip, with the integer register file ranked as the hottest unit in high-performance microprocessors. In this paper, we ...
ISCAS
2008
IEEE
15 years 4 months ago
2008
IEEE
— In this paper, we have proposed a thermal aware routing based parameterization to generate a clock model that takes the stochastic temperature variation into consideration. The...
ICCD
2006
IEEE
15 years 6 months ago
2006
IEEE
This paper proposes a stochastic dynamic thermal management (DTM) technique in high-performance VLSI system with especial attention to the uncertainty in temperature observation. ...
ICCAD
2008
IEEE
15 years 6 months ago
2008
IEEE
Abstract—On-chip power density and temperature are rising exponentially with decreasing feature sizes. This alarming trend calls for temperature management at every level of syst...