1635 search results - page 12 / 327 » Thermally Aware Design |
DAC
2008
ACM
14 years 11 months ago
2008
ACM
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
VLSID
2010
IEEE
14 years 8 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
ISCAS
2006
IEEE
15 years 3 months ago
2006
IEEE
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
ISPD
2003
ACM
15 years 2 months ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
Global interconnect temperature keeps rising in the current and future technologies due to self-heating and the adiabatic property of top metal layers. The thermal e ects impact a...