1635 search results - page 14 / 327 » Thermally Aware Design |
HPCA
2008
IEEE
15 years 10 months ago
2008
IEEE
Designing thermal management policies for today's power-dense server clusters is currently a challenge, since it is difficult to predict the exact temperature and performance...
DATE
2010
IEEE
15 years 2 months ago
2010
IEEE
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation co...
ISLPED
2009
ACM
15 years 4 months ago
2009
ACM
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
DATE
2006
IEEE
15 years 3 months ago
2006
IEEE
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
ISQED
2007
IEEE
15 years 3 months ago
2007
IEEE
— In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power and energy optimization in embedded system design. As thermal issues become increasingl...