1635 search results - page 20 / 327 » Thermally Aware Design |
97
Voted
DAC
2008
ACM
15 years 10 months ago
2008
ACM
Recently, processor power density has been increasing at an alarming rate resulting in high on-chip temperature. Higher temperature increases current leakage and causes poor relia...
GLVLSI
2000
IEEE
15 years 2 months ago
2000
IEEE
— Typically, placement algorithms attempt to minimize the total net length of a printed circuit board (PCB). However, an MCM’s increased throughput and dense circuitry can easi...
86
Voted
TDSC
2010
14 years 4 months ago
2010
The instruction cache has been recognized as one of the least hot units in microprocessors, which leaves the instruction cache largely ignored in onchip thermal management. Consequ...
84
Voted
DAC
2006
ACM
15 years 10 months ago
2006
ACM
With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...
ICCD
2004
IEEE
15 years 6 months ago
2004
IEEE
Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...