1635 search results - page 24 / 327 » Thermally Aware Design |
ASPDAC
2006
ACM
15 years 3 months ago
2006
ACM
: With technology scaling, elevated temperatures caused by increased power density create a critical bottleneck modulating the circuit operation. With the advent of FinFET technolo...
CHI
2011
ACM
14 years 1 months ago
2011
ACM
Thermal stimulation is a rich, emotive and salient feedback channel that is well suited to HCI, but one that is yet to be fully investigated. Thermal feedback may be suited to env...
CASES
2008
ACM
14 years 11 months ago
2008
ACM
Power, energy, and thermal concerns have constrained embedded systems designs. Computing capability and storage density have increased dramatically, enabling the emergence of hand...
58
Voted
FBIT
2007
IEEE
15 years 4 months ago
2007
IEEE
We have been developing a miniature multi-function haptic device - a tactor - that generates the sense of pressure, vibration, shear force, and temperature for upper extremity amp...
DATE
2006
IEEE
15 years 3 months ago
2006
IEEE
The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...