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TCAD
2008
14 years 9 months ago
2008
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
ISQED
2007
IEEE
15 years 3 months ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
MSO
2003
14 years 11 months ago
2003
The Tracker is one of the CMS (Compact Muon Solenoid experiment) detectors to be installed at the LHC (Large Hadron Collider) accelerator, scheduled to start data taking in 2007. ...
ASPLOS
2006
ACM
15 years 3 months ago
2006
ACM
Power densities have been increasing rapidly at all levels of server systems. To counter the high temperatures resulting from these densities, systems researchers have recently st...