1635 search results - page 26 / 327 » Thermally Aware Design |
ASPDAC
2006
ACM
15 years 3 months ago
2006
ACM
- Traditionally, minimum possible area of a VLSI layout is considered the best for delay and power minimization due to decreased interconnect capacitance. This paper shows however ...
78
Voted
HPCA
2006
IEEE
15 years 10 months ago
2006
IEEE
This paper explores the multi-dimensional design space for chip multiprocessors, exploring the inter-related variables of core count, pipeline depth, superscalar width, L2 cache s...
FPL
2006
Springer
15 years 1 months ago
2006
Springer
Given large circuit sizes, high clock frequencies, and possibly extreme operating environments, Field Programmable Gate Arrays (FPGAs) are capable of heating beyond their designed...
62
Voted
DATE
2010
IEEE
15 years 2 months ago
2010
IEEE
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
ASPDAC
2006
ACM
15 years 1 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...