1635 search results - page 30 / 327 » Thermally Aware Design |
DAC
2005
ACM
15 years 10 months ago
2005
ACM
80
Voted
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
CSCW
2002
ACM
14 years 9 months ago
2002
ACM
Supporting awareness of others is an idea that holds promise for improving the usability of real-time distributed groupware. However, there is little principled information availa...
DAC
2009
ACM
15 years 10 months ago
2009
ACM
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
ICCAD
2006
IEEE
15 years 6 months ago
2006
IEEE
In the past, processor design trends were dominated by increasingly complex feature sets, higher clock speeds, growing thermal envelopes and increasing power dissipation. Recently...