1635 search results - page 35 / 327 » Thermally Aware Design |
MR
2008
14 years 9 months ago
2008
This paper presents a study of the thermal spreading resistance Rth of a small heat source on a conductive substrate subject to bottomside convective cooling. This problem has bee...
ICCAD
2009
IEEE
14 years 7 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
HPCA
2005
IEEE
15 years 3 months ago
2005
IEEE
With technology scaling, power dissipation and localized heating in global and semi-global bus wires are becoming increasingly important, and this necessitates the development of ...
DAC
2012
ACM
13 years 2 days ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
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DAC
2012
ACM
13 years 2 days ago
2012
ACM
Full-chip thermal monitoring is an important and challenging issue in today’s microprocessor design. In this paper, we propose a new information-theoretic framework to quantitat...