1635 search results - page 39 / 327 » Thermally Aware Design |
ISQED
2008
IEEE
15 years 4 months ago
2008
IEEE
In multi-core processors there are several ways to pair a thread to a particular core. These load-balancing techniques result in a quite different power, performance and thermal b...
ISPASS
2005
IEEE
15 years 3 months ago
2005
IEEE
We have previously presented Qsilver, a flexible simulation system for graphics architectures. In this paper we describe our extensions to this system, which we use— instrument...
60
Voted
ASPDAC
2009
ACM
15 years 4 months ago
2009
ACM
— The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
67
Voted
ISCAS
2007
IEEE
15 years 4 months ago
2007
IEEE
Abstract— Thermal characterization of ICs and on-chip temperature monitoring has become a key task in electronic engineering. In this paper, we present the design of an on-chip C...
CORR
2007
Springer
14 years 9 months ago
2007
Springer
In this paper, the CFD approach is used to simulate the thermal behavior in a sensitive high-Q gyroscope. The electromagnetically driving wires, in which the alternating current f...