1635 search results - page 42 / 327 » Thermally Aware Design |
CLUSTER
2005
IEEE
15 years 3 months ago
2005
IEEE
We present a feasibility study of a power-reduction scheme that reduces the thermal power of processors by lowering frequency and voltage in the context of high-performance comput...
GMP
2010
IEEE
15 years 2 months ago
2010
IEEE
Abstract. In isogeometric analysis (IGA for short) framework, computational domain is exactly described using the same representation as that employed in the CAD process. For a CAD...
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
IGARSS
2010
14 years 7 months ago
2010
The Landsat Data Continuity Mission (LDCM), a joint NASA and USGS mission, is scheduled for launch in December, 2012. The LDCM instrument payload will consist of the Operational L...