1635 search results - page 4 / 327 » Thermally Aware Design |
82
Voted
TVLSI
2008
14 years 9 months ago
2008
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
ASPDAC
2007
ACM
15 years 1 months ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
— Memories are increasingly dominating Systems on Chip (SoC) designs and thus contribute a large percentage of the total system’s power dissipation, area and reliability. In th...
ISQED
2010
IEEE
15 years 4 months ago
2010
IEEE
Abstract— As the semiconductor technology continues its marching toward the deep sub-micron domain, the strong relation between leakage current and temperature becomes critical i...
VLSID
2009
IEEE
15 years 10 months ago
2009
IEEE
Power density has been increasing at an alarming rate in recent processor generations resulting in high on-chip temperature. Higher temperature results in poor reliability and inc...