Sciweavers

1635 search results - page 54 / 327
» Thermally Aware Design
Sort
View
DATE
2005
IEEE
154views Hardware» more  DATE 2005»
15 years 3 months ago
Top-Down Design of a Low-Power Multi-Channel 2.5-Gbit/s/Channel Gated Oscillator Clock-Recovery Circuit
We present a complete top-down design of a low-power multi-channel clock recovery circuit based on gated current-controlled oscillators. The flow includes several tools and method...
Paul Muller, Armin Tajalli, Seyed Mojtaba Atarodi,...
DATE
2006
IEEE
71views Hardware» more  DATE 2006»
15 years 3 months ago
Exploring "temperature-aware" design in low-power MPSoCs
The power density inside high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating “hot spot...
Giacomo Paci, Paul Marchal, Francesco Poletti, Luc...
ISCAS
2003
IEEE
62views Hardware» more  ISCAS 2003»
15 years 3 months ago
Simple noise formulas for MOS analog design
The designer needs simple and accurate models to estimate noise in MOS transistors as a function of their size, bias point and technology. In this work, we present a simple, conti...
Alfredo Arnaud, Carlos Galup-Montoro
DAC
2001
ACM
15 years 10 months ago
Future Performance Challenges in Nanometer Design
We highlight several fundamental challenges to designing highperformance integrated circuits in nanometer-scale technologies (i.e. drawn feature sizes < 100 nm). Dynamic power ...
Dennis Sylvester, Himanshu Kaul
DAC
2006
ACM
15 years 10 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...