1635 search results - page 7 / 327 » Thermally Aware Design |
NOCS
2010
IEEE
14 years 8 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
IJES
2007
14 years 9 months ago
2007
: The power density in high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating ‘hot spotsâ€...
ASPDAC
2006
ACM
15 years 3 months ago
2006
ACM
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
DAC
2006
ACM
15 years 10 months ago
2006
ACM
Modern high performance processors employ advanced techniques for thermal management, which rely on accurate readings of on-die thermal sensors. As the importance of thermal effec...
CAD
2006
Springer
14 years 9 months ago
2006
Springer
This paper presents a virtual CAD system developed for clothing thermal functional design and simulation. It allows designers and engineers in virtual space to design and preview ...