1635 search results - page 8 / 327 » Thermally Aware Design |
ENGL
2007
14 years 9 months ago
2007
Abstract—This paper presents a systematic approach for the design of temperature controller using genetic algorithms (GAs) for thermal power plant subsystems and investigates the...
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DAC
2011
ACM
13 years 9 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
DSD
2009
IEEE
15 years 4 months ago
2009
IEEE
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
ASPDAC
2009
ACM
15 years 4 months ago
2009
ACM
— Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC designers. In this work, we model the thermal behavior of a MPSoC as a control theory pro...
DATE
2004
IEEE
15 years 1 months ago
2004
IEEE
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and power integrity has become serious concern. Although the impacts of thermal effects...