17 search results - page 2 / 4 » Three Dimensional VLSI-Scale Interconnects |
ICCD
2005
IEEE
14 years 3 months ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
ISVLSI
2003
IEEE
13 years 11 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
CSC
2006
2006
An Adaptive Method for Flow Simulation in Three-Dimensional Heterogeneous Discrete Fracture Networks
13 years 7 months ago
Natural fractured media are highly unpredictable because of existing complex structures at the fracture and at the network levels. Fractures are by themselves heterogeneous objects...
DAC
2007
ACM
13 years 10 months ago
2007
ACM
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
JIB
2008
13 years 6 months ago
2008
Biological data is often structured in the form of complex interconnected networks such as protein interaction and metabolic networks. In this paper, we investigate a new problem ...