Sciweavers

17 search results - page 4 / 4
» Three Dimensional VLSI-Scale Interconnects
Sort
View
ICCAD
2004
IEEE
138views Hardware» more  ICCAD 2004»
14 years 3 months ago
A thermal-driven floorplanning algorithm for 3D ICs
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
Jason Cong, Jie Wei, Yan Zhang
VRML
2009
ACM
14 years 27 days ago
Extending X3D for distributed multimedia processing and control
Web-based applications of interactive 3D computer graphics are showing a tendency to get more interconnected and visually complex. Virtual communities like Second Life demand real...
Michael Repplinger, Alexander Löffler, Benjam...