1476 search results - page 105 / 296 » Three-dimensional integrated circuits |
150
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DAC
2006
ACM
15 years 11 months ago
2006
ACM
duce system weight and volume, increase operating lifetime, The recent explosion in capability of embedded and portable decrease maintenance costs, and open new frontiers for inele...
126
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ICCAD
2003
IEEE
16 years 1 months ago
2003
IEEE
Placement is one of the most important steps in the RTLto-GDSII synthesis process, as it directly defines the interconnects, which have become the bottleneck in circuit and syste...
134
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DAC
2006
ACM
16 years 6 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
157
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ISPD
2010
ACM
15 years 11 months ago
2010
ACM
Timing-driven placement is a critical step in nanometerscale physical synthesis. To improve design timing on a global scale, net-weight based global timing-driven placement is a c...
153
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MICRO
2003
IEEE
15 years 10 months ago
2003
IEEE
With increasing clock frequencies and silicon integration, power aware computing has become a critical concern in the design of embedded processors and systems-on-chip. One of the...