1476 search results - page 110 / 296 » Three-dimensional integrated circuits |
167
Voted
EVOW
2001
Springer
15 years 9 months ago
2001
Springer
The integrated circuits design flow is rapidly moving towards higher description levels. However, test-related activities are lacking behind this trend, mainly since effective faul...
155
Voted
ICCAD
2003
IEEE
15 years 10 months ago
2003
IEEE
This paper presents several important enhancements to the recently published multilevel placement package mPL [12]. The improvements include (i) unconstrained quadratic relaxation...
124
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FPGA
2003
ACM
15 years 10 months ago
2003
ACM
As integrated circuits become more and more complex, the ability to make post-fabrication changes will become more and more attractive. This ability can be realized using programm...
148
Voted
ICCAD
2003
IEEE
16 years 1 months ago
2003
IEEE
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal ...
137
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ICCAD
2001
IEEE
16 years 1 months ago
2001
IEEE
We present a methodology for generating black-box timing models for full-custom transistor-level CMOS circuits. Our approach utilizes transistor-level ternary symbolic timing simu...