1476 search results - page 137 / 296 » Three-dimensional integrated circuits |
174
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ASPDAC
2008
ACM
15 years 8 months ago
2008
ACM
ACT Benchmarks are an immensely useful tool in performing research since they allow for rapid and clear comparison between different approaches to solving CAD problems. Recent expe...
157
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JETC
2008
15 years 4 months ago
2008
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
187
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VLSID
2007
IEEE
16 years 6 months ago
2007
IEEE
Title of thesis: EFFICIENT AND ACCURATE STATISTICAL TIMING ANALYSIS FOR NON-LINEAR NON-GAUSSIAN VARIABILITY WITH INCREMENTAL ATTRIBUTES Ashish Dobhal, Master of Science, 2006 Thes...
249
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ISPD
2011
ACM
14 years 9 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
153
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ICIP
2008
IEEE
16 years 7 months ago
2008
IEEE
The continual shrinkage of minimum feature size in integrated circuit (IC) fabrication incurs more and more serious distortion in the optical lithography process, generating circu...