1476 search results - page 154 / 296 » Three-dimensional integrated circuits |
185
click to vote
FPGA
2005
ACM
15 years 11 months ago
2005
ACM
Creating a new FPGA is a challenging undertaking because of the significant effort that must be spent on circuit design, layout and verification. It currently takes approximately ...
266
click to vote
Publication
Within-die process variations arise during integrated circuit (IC) fabrication in the sub-100nm regime. These variations are of paramount concern as they deviate the performance of...
192
click to vote
DAC
2003
ACM
16 years 7 months ago
2003
ACM
As power consumption of the clock tree in modern VLSI designs tends to dominate, measures must be taken to keep it under control. This paper introduces an approach for reducing cl...
169
click to vote
DAC
2005
ACM
16 years 7 months ago
2005
ACM
Small, embedded integrated circuits (ICs) such as smart cards are vulnerable to so-called side-channel attacks (SCAs). The attacker can gain information by monitoring the power co...
149
click to vote
ICCD
2003
IEEE
16 years 3 months ago
2003
IEEE
There is currently a huge gap between the two main technologies used to implement custom digital integrated circuit (IC) designs. At one end of the spectrum are field programmable...