1476 search results - page 157 / 296 » Three-dimensional integrated circuits |
166
Voted
DAC
2000
ACM
15 years 10 months ago
2000
ACM
The decrease in feature size and added chip functionality in large sub-micron integrated circuits demand larger grids for power distribution. Since power grids are performance lim...
199
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ASAP
1997
IEEE
15 years 10 months ago
1997
IEEE
Improvements in semiconductor integration density and the resulting problem of having to manage designs of increasing complexity is an old one, but still current. The new challeng...
181
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TVLSI
2002
15 years 5 months ago
2002
Although simulation remains an important part of application-specific integrated circuit (ASIC) validation, hardware-assisted parallel verification is becoming a larger part of the...
166
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ICCAD
2010
IEEE
15 years 4 months ago
2010
IEEE
In this paper, we propose a new technique, referred to as MultiWafer Virtual Probe (MVP) to efficiently model wafer-level spatial variations for nanoscale integrated circuits. Tow...
154
Voted
VLSI
2010
Springer
15 years 24 days ago
2010
Springer
Electro-Magnetic Analysis has been identified as an efficient technique to retrieve the secret key of cryptographic algorithms. Although similar mathematically speaking, Power or E...