1476 search results - page 158 / 296 » Three-dimensional integrated circuits |
178
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DAC
2011
ACM
14 years 6 months ago
2011
ACM
In the era of deep sub-wavelength lithography for nanometer VLSI designs, manufacturability and yield issues are critical and need to be addressed during the key physical design i...
166
Voted
ASPDAC
2012
ACM
14 years 1 months ago
2012
ACM
— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
207
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ISPD
2012
ACM
14 years 1 months ago
2012
ACM
Importance sampling is a popular approach to estimate rare event failures of SRAM cells. We propose to improve importance sampling by probability collectives. First, we use “Kul...
184
Voted
DAC
2012
ACM
13 years 8 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
176
Voted
DAC
2012
ACM
13 years 8 months ago
2012
ACM
Large-scale process variations can significantly limit the practical utility of microelectro-mechanical systems (MEMS) for RF (radio frequency) applications. In this paper we desc...