1476 search results - page 164 / 296 » Three-dimensional integrated circuits |
144
Voted
GLVLSI
2003
IEEE
15 years 11 months ago
2003
IEEE
Concerned by the wall that Moore’s Law is expected to hit in the next decade, the integrated circuit community is turning to emerging nanotechnologies for continued device impro...
170
Voted
DAC
2004
ACM
16 years 7 months ago
2004
ACM
We describe a new extraction tool, EMX (Electro-Magnetic eXtractor), for the analysis of RF, analog and high-speed digital circuits. EMX is a fast full-wave field solver. It incor...
150
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ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
—Hardware Intellectual Property (IP) cores have emerged as an integral part of modern System–on–Chip (SoC) designs. However, IP vendors are facing major challenges to protect...
137
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
—Decoupling capacitors (decaps) are a popular means for reducing power-supply noise in integrated circuits. Since the decaps are usually inserted in the whitespace of the device ...
149
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PRDC
2008
IEEE
16 years 16 days ago
2008
IEEE
Advancements in technology enable integration of a large number of cores on a single silicon die. At the same time, aggressive technology scaling has an ever-increasing adverse im...