Sciweavers

1476 search results - page 167 / 296
» Three-dimensional integrated circuits
Sort
View
ISQED
2008
IEEE
66views Hardware» more  ISQED 2008»
16 years 19 days ago
An Implementation of Performance-Driven Block and I/O Placement for Chip-Package Codesign
– As silicon technology scales, we can integrate more and more circuits on a single chip, which means more I/Os are needed in modern designs. The flip-chip technology which was ...
Ming-Fang Lai, Hung-Ming Chen
LCN
2003
IEEE
15 years 11 months ago
An Optoelectronic Multi-Terabit CMOS Switch Core for Local Area Networks
Optoelectronic integrated circuits can support thousands of integrated optical laser diodes and photodetectors bonded to a high-performance CMOS substrate, and can be used in the ...
Honglin Wu, Amir Gourgy, Ted H. Szymanski
ICCAD
2006
IEEE
139views Hardware» more  ICCAD 2006»
16 years 3 months ago
Analog placement with symmetry and other placement constraints
In order to handle device matching in analog circuits, some pairs of modules are required to be placed symmetrically. This paper addresses this device-level placement problem for ...
Yiu-Cheong Tam, Evangeline F. Y. Young, Chris C. N...
ASPDAC
2005
ACM
65views Hardware» more  ASPDAC 2005»
15 years 11 months ago
Multilevel full-chip gridless routing considering optical proximity correction
To handle modern routing with nanometer effects, we need to consider designs of variable wire widths and spacings, for which gridless routers are desirable due to their great fle...
Tai-Chen Chen, Yao-Wen Chang
SLIP
2005
ACM
15 years 11 months ago
Congestion prediction in early stages
Routability optimization has become a major concern in the physical design cycle of VLSI circuits. Due to the recent advances in VLSI technology, interconnect has become a dominan...
Chiu-Wing Sham, Evangeline F. Y. Young