166 search results - page 1 / 34 » Through Silicon Vias as Enablers for 3D Systems |
68
Voted
CORR
2008
Springer
15 years 25 days ago
2008
Springer
This special session on 3D TSV
133
Voted
NANONET
2009
Springer
15 years 5 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
105
Voted
ICCD
2007
IEEE
15 years 9 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
94
Voted
DATE
2009
IEEE
15 years 7 months ago
2009
IEEE
Abstract—Convergence of communication, consumer applications and computing within mobile systems pushes memory requirements both in terms of size, bandwidth and power consumption...
136
Voted
GLVLSI
2009
IEEE
14 years 10 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...