166 search results - page 11 / 34 » Through Silicon Vias as Enablers for 3D Systems |
MM
2006
ACM
15 years 3 months ago
2006
ACM
Front projection allows large displays to be deployed relatively easily. However, it is sometimes difficult to find a location to place a projector, especially for ad-hoc instal...
DAC
2010
ACM
15 years 1 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
ICAT
2003
IEEE
15 years 2 months ago
2003
IEEE
Conventional display in robotic surgery such as flat displays or stereoscopic displays decreases obtainable information around target tissue. For supporting manipulation and perfo...
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ASAP
2011
IEEE
13 years 9 months ago
2011
IEEE
—The domain of vision and navigation often includes applications for feature tracking as well as simultaneous localization and mapping (SLAM). As these problems require computati...
MOBISYS
2008
ACM
15 years 9 months ago
2008
ACM
It is now common for Web sites to use active Web content, such as Flash, Silverlight, or Java applets, to support rich, interactive applications. For many mobile devices, however,...