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NOCS
2010
IEEE
15 years 5 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
136
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CVPR
2000
IEEE
16 years 9 months ago
2000
IEEE
135
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ICCAD
2001
IEEE
16 years 4 months ago
2001
IEEE
