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DAC
2006
ACM
15 years 11 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
STACS
1997
Springer
15 years 2 months ago
Methods and Applications of (MAX, +) Linear Algebra
Exotic semirings such as the “(max, +) semiring” (R ∪ {−∞}, max, +), or the “tropical semiring” (N ∪ {+∞}, min, +), have been invented and reinvented many times s...
Stephane Gaubert, Max Plus
DATE
2006
IEEE
152views Hardware» more  DATE 2006»
15 years 4 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
ASE
2008
135views more  ASE 2008»
14 years 10 months ago
Deriving event-based transition systems from goal-oriented requirements models
Goal-oriented methods are increasingly popular for elaborating software requirements. They offer systematic support for incrementally building intentional, structural, and operati...
Emmanuel Letier, Jeff Kramer, Jeff Magee, Sebasti&...
SAS
2001
Springer
121views Formal Methods» more  SAS 2001»
15 years 2 months ago
Embedding Chaos
Model checking would answer all finite-state verification problems, if it were not for the notorious state-space explosion problem. A problem of practical importance, which attra...
Natalia Sidorova, Martin Steffen