Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
— A methodology is proposed for interdependent setup time and hold time characterization of sequential circuits. Integrating the methodology into an industrial sign-off static ti...
Emre Salman, Eby G. Friedman, Ali Dasdan, Feroze T...
Abstract — Nanoelectronic design faces unprecedented reliability challenges and must achieve noise immunity and delay insensitiveness in the presence of prevalent defects and sig...
We introduce discrete pushdown timed automata that are timed automata with integer-valued clocks augmented with a pushdown stack. A con guration of a discrete pushdown timed automa...
Zhe Dang, Oscar H. Ibarra, Tevfik Bultan, Richard ...
In this paper we develop a methodology for treating the problem of scheduling partially-ordered tasks on parallel machines. Our framework is based on the timed automaton model, or...