In the nanometer VLSI technology, the variation effects like manufacturing variation, power supply noise, temperature etc. become very significant. As one of the most vital nets...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
The unique and unpredictable nature of silicon enables the use of physical unclonable functions (PUFs) for chip identification and authentication. Since the function of PUFs depen...
Lang Lin, Daniel E. Holcomb, Dilip Kumar Krishnapp...
The random accumulation of variations in the human genome over time implicitly encodes a history of how human populations have arisen, dispersed, and intermixed since we emerged as...
Ming-Chi Tsai, Guy E. Blelloch, R. Ravi, Russell S...
This paper presents a new incremental learning solution for Linear Discriminant Analysis (LDA). We apply the concept of the sufficient spanning set approximation in each update st...