628 search results - page 113 / 126 » Towards High-Level Programming for Distributed Problem Solvi... |
ICCAD
2005
IEEE
15 years 6 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
85
Voted
ATAL
2010
Springer
14 years 10 months ago
2010
Springer
The coordination of emergency responders and robots to undertake a number of tasks in disaster scenarios is a grand challenge for multi-agent systems. Central to this endeavour is...
88
Voted
CORR
2010
Springer
14 years 6 months ago
2010
Springer
We investigate optimal routing and scheduling strategies for multi-hop wireless networks with rateless codes. Rateless codes allow each node of the network to accumulate mutual in...
SIGMETRICS
2009
ACM
15 years 4 months ago
2009
ACM
We consider the problem of admission control in resource sharing systems, such as web servers and transaction processing systems, when the job size distribution has high variabili...
CASES
2007
ACM
15 years 1 months ago
2007
ACM
We derive analytically, the performance optimal throttling curve for a processor under thermal constraints for a given task sequence. We found that keeping the chip temperature co...