4866 search results - page 763 / 974 » UML for Global Computing |
151
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DAC
2007
ACM
16 years 5 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
114
Voted
DAC
2000
ACM
16 years 5 months ago
2000
ACM
Technology extrapolation -- the calibration and prediction of achievable design in future technology generations ? drives the evolution of VLSI system architectures, design method...
127
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DAC
2000
ACM
16 years 5 months ago
2000
ACM
Memory delays represent a major bottleneck in embedded systems performance. Newer memory modules exhibiting efficient access modes (e.g., page-, burst-mode) partly alleviate this ...
129
Voted
DAC
2000
ACM
16 years 5 months ago
2000
ACM
In this paper we describe a new hardware/software partitioning approach for embedded reconfigurable architectures consisting of a general-purpose processor (CPU), a dynamically re...
156
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DAC
2001
ACM
16 years 5 months ago
2001
ACM
Asynchronous design has been the focus of renewed interest. However, a key bottleneck is the lack of high-quality CAD tools for the synthesis of large-scale systems which also all...