Sciweavers

1217 search results - page 212 / 244
» Uncertainty-aware circuit optimization
Sort
View
57
Voted
ICCAD
2001
IEEE
100views Hardware» more  ICCAD 2001»
15 years 6 months ago
Coupled Analysis of Electromigration Reliability and Performance in ULSI Signal Nets
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
Kaustav Banerjee, Amit Mehrotra
ICCAD
2001
IEEE
107views Hardware» more  ICCAD 2001»
15 years 6 months ago
A Convex Programming Approach to Positive Real Rational Approximation
As system integration evolves and tighter design constraints must be met, it becomes necessary to account for the non-ideal behavior of all the elements in a system. Certain devic...
Carlos P. Coelho, Joel R. Phillips, Luis Miguel Si...
92
Voted
ISPD
2010
ACM
249views Hardware» more  ISPD 2010»
15 years 4 months ago
A matching based decomposer for double patterning lithography
Double Patterning Lithography (DPL) is one of the few hopeful candidate solutions for the lithography for CMOS process beyond 45nm. DPL assigns the patterns less than a certain di...
Yue Xu, Chris Chu
DATE
2009
IEEE
112views Hardware» more  DATE 2009»
15 years 4 months ago
Package routability- and IR-drop-aware finger/pad assignment in chip-package co-design
—Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...
Chao-Hung Lu, Hung-Ming Chen, Chien-Nan Jimmy Liu,...
63
Voted
ISQED
2008
IEEE
66views Hardware» more  ISQED 2008»
15 years 3 months ago
An Implementation of Performance-Driven Block and I/O Placement for Chip-Package Codesign
– As silicon technology scales, we can integrate more and more circuits on a single chip, which means more I/Os are needed in modern designs. The flip-chip technology which was ...
Ming-Fang Lai, Hung-Ming Chen