In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
As system integration evolves and tighter design constraints must be met, it becomes necessary to account for the non-ideal behavior of all the elements in a system. Certain devic...
Carlos P. Coelho, Joel R. Phillips, Luis Miguel Si...
Double Patterning Lithography (DPL) is one of the few hopeful candidate solutions for the lithography for CMOS process beyond 45nm. DPL assigns the patterns less than a certain di...
—Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...
Chao-Hung Lu, Hung-Ming Chen, Chien-Nan Jimmy Liu,...
– As silicon technology scales, we can integrate more and more circuits on a single chip, which means more I/Os are needed in modern designs. The flip-chip technology which was ...